Thermal paste, 5.5 g CPU paste heat sink for IC/processor/CPU/all coolers, carbon based high performance

Description

🔥 Keep your cool with BSFF – the thermal paste that outperforms and outlasts!

BSFF Thermal Paste is a 5.5g carbon-based, metal-free thermal compound designed for CPUs, GPUs, and heat sinks. It offers superior heat dissipation with high thermal conductivity, ensuring efficient cooling and system stability. Safe to use with no risk of short circuits, it maintains peak performance for over 5 years without needing reapplication, making it a reliable choice for professionals and enthusiasts alike.